Title here
Summary here
Specifications
Recommended Operating Conditions
| SUPPLY VOLTAGE | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|
| 12 VDC | +11.4 | +12 | +12.6 | V |
| 3.3 VDC | +3.14 | +3.3 | +3.46 | V |
| VADJ (1.2VDC) | +1.14 | +1.2 | +1.26 | V |
| VADJ (1.5VDC) | +1.425 | +1.5 | +1.575 | V |
| VADJ (1.8VDC) | +1.71 | +1.8 | +1.89 | V |
| VADJ (2.5VDC) | +2.375 | +2.5 | +2.625 | V |
| VADJ (3.3VDC) | +3.135 | +3.3 | +3.465 | V |
Notes:
- The mezzanine card does not use or draw any current from the 12VDC supply of the FMC carrier.
- All VADJ pins must be supplied with the same voltage chosen from one of the following levels: +1.2VDC, +1.5VDC, +1.8VDC, +2.5VDC, +3.3VDC. Note that many carriers have a system controller that will make this choice for you.
Power Consumption
This section is incomplete and awaiting test results.
The specifications below refer to the total current draw on each of the power supplies while the MCIO PCIe FMC is connected to a development board and has 2x SSDs connected.
| SUPPLY | UTILIZATION | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| 12 VDC | 0 | mA | |||
| 3.3 VDC | LIGHT | TBD | mA | ||
| 3.3 VDC | MAXIMUM | TBD | mA | ||
| VADJ | LIGHT | TBD | mA | ||
| VADJ | MAXIMUM | TBD | mA |
- Tests performed at ambient temperature of 25 degrees C
- Tests performed using the ZCU102 development board
- Tests performed between 2x MCIO PCIe FMCs, with one in host mode and the other in device mode
- Light utilization test: FMC powered but no gigabit links enabled
- Maximum utilization test: FMC powered and 8-lane IBERT connection at 16Gbps per lane
- VADJ current draw was measured for VADJ of 1.8VDC and may be different for other levels
Note that the MCIO PCIe FMC example design will also produce an increase in power consumption of the FPGA/MPSoC on the development board due to the use of FPGA and hardware resources.
Thermal Information
We have not performed comprehensive thermal testing on the MCIO PCIe FMC, however we recommend that it be operated under ambient temperatures limited to between -20 and 70 degrees C. The active devices on the mezzanine card itself have operating ranges that exceed this recommendation and are listed in the table below.
Component Ambient Operating Temperatures
| DEVICE | MIN | MAX | UNIT |
|---|---|---|---|
| TI, I2C Level Translator, TCA9416DDFR | -40 | 125 | C |
| TI, 480Mbps MUX/DEMUX Switch, TMUXHS221NKGR | -40 | 125 | C |
| TI, PCIe Gen5 Redriver, DS320PR810NJXT | -40 | 85 | C |
| TI, Level Translator, SN74AVC4T245RSVR | -40 | 85 | C |
| MicroChip, 2x Output PCIe Clock Generator, DSC557-0334FI1 | -40 | 85 | C |
| Microchip, 2Kbit EEPROM, 34AA02T-I/OT | -40 | 85 | C |
| Amphenol ICC, 8xMCIO Connector, G97R22312HR | -40 | 85 | C |
Components that are not listed in the table above (such as resistors, capacitors) are selected to have minimum operating temperature that is lower than -20 degrees C, and maximum operating temperature that is at least 85 degrees C.
I2C (EEPROM) Timing
The serial EEPROM (part number Microchip, 2Kbit EEPROM, 34AA02T-I/OT ) has a maximum operating clock frequency of 400 kHz.
Certifications
- RoHS
- CE
- UKCA